Wafer carrier handling methods, systems and apparatus for semiconductor wafer fabrication

ABSTRACT

A system and method is provided for transporting wafers in wafer carriers to a fabrication tool. The system provides an incoming carrier location adapted to receive a wafer lot carrier containing a wafer lot, a divider mechanism adapted to divide and place the wafers into a plurality of sublot carriers wherein each sublot carrier includes a fewer number of wafers than the wafer lot carrier, and a transfer mechanism adapted to transfer the plurality of sublot carriers. Inventive wafer handling methods, which divide a wafer lot into wafer sublots and distributes the sublots among tools configured to perform processes on the wafers is provided. Apparatus adapted to divide the wafer lot into sublots are also provided, as are other aspects.

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 11/764,735, filed Jun. 18, 2007 (AMAT Docket No.1600/P01/C02/FEG/SYNX/CROCKER S), which is a continuation of and claimspriority to U.S. patent application Ser. No. 10/348,836, filed Jan. 22,2003 (AMAT Docket No. 1600/P01/C01/FEG/SYNX/CROCKER S), now abandoned,which is a continuation of and claims priority to U.S. patentapplication Ser. No. 09/350,867, filed Jul. 9, 1999 (AMAT Docket No.1600/P1/ATD/MBE), now U.S. Pat. No. 6,540,466, which is acontinuation-in-part of and claims priority to U.S. patent applicationSer. No. 08/764,661, filed Dec. 11, 1996 (AMAT Docket No. 1600/ATD/MBE),now U.S. Pat. No. 5,957,648. Each of these patent applications is herebyincorporated by reference herein in its entirety.

FIELD OF THE INVENTION

The present invention relates generally to semiconductor waferfabrication systems, and to an improved methods and apparatus forstoring and loading semiconductor wafer carriers at a givensemiconductor wafer fabrication tool.

BACKGROUND OF THE INVENTION

The drive for reduced cost per unit wafer processed characterizes thesemiconductor industry. Thus the semiconductor industry continuouslysearches for ways to increase wafer output and/or reduce overallequipment costs (costs of ownership). Among the factors significantlyaffecting cost of ownership for a given piece of equipment are cleanroom costs, footprint and labor costs. It is well recognized thatoverall semiconductor wafer fabrication system (i.e., fabrication tool)productivity increases are achieved by ensuring a constant supply ofwafers at each tool. Conventionally this has been accomplished byemploying a local buffer supply (i.e., a supply of wafers at the tool).For example, the “MINI BUFFER” marketed by Jenoptik/Infab is a verticalbuffer which is positioned near a fabrication tool's load lock chambers.The MINI BUFFER comprises a series of vertically arranged shelves andone or more load ports for access by the tool's loader robot, and/or foraccess by factory transport agents (i.e., the mechanism that transferswafer carriers from the factory to the buffer apparatus' factory loadport). Conventionally one MINI BUFFER is positioned near each load lock,a distance from the load lock sufficient to accommodate the axis ofrotation of a front loader robot. The loader robot may then accesseither MINI BUFFER to obtain a wafer carrier for loading to either loadlock. Although such methods maintain a constant local buffer supply ofwafer carriers, they occupy a considerable amount of floor space thusincreasing the system's cost of ownership. The fact that fabricationtools are frequently maintained in a clean room environment furtherexacerbates the increased cost associated with the system's largerfootprint.

In addition, most prior art systems do not allow simultaneous access bythe tool loader and the factory transport agent, and thereby complicatefactory transport scheduling, and can result in throughput reduction.

Accordingly, there is a need for apparatuses and methods which canreduce footprint and/or increase machine/factory throughput.

SUMMARY OF THE INVENTION

In its broadest aspect the invention comprises a load/buffer adapted toprovide local storage of wafer carriers at a fabrication tool, theload/buffer comprising a first factory load port adapted to receivewafer carriers to be transferred to and from the factory, a wafercarrier store, a first wafer carrier transfer mechanism adapted totransfer wafer carriers between the factory load port and the store, afirst tool load port adapted to receive wafer carriers to be accessed bya fabrication tool, and a second wafer carrier transfer mechanismadapted to transfer wafer carriers between the tool load port and thestore.

The wafer carrier store may comprise for example, a shelf, shelves, or aconveyor, and the wafer carrier transfer mechanisms may comprise forexample, a shelf capable of raising or lowering the wafer carrierbetween the wafer carrier store and the load port (in which caserollers, a wafer handler or the like may transfer the wafer carrierbetween the shelf and the wafer carrier store), or a wafer handlercapable of transferring the wafer carriers between the port and thestore. The ports may be positioned at the height set by SEMI standardE15, or may be at a height greater than that of the fabrication tool,etc. The inventive apparatus may be positioned in front of thefabrication tool, beside the fabrication tool, at least partially abovethe fabrication tool, etc.

To enhance throughput, a plurality of load buffers may be connected sothat one fabrication tool can receive a wafer carrier from the wafercarrier store of another fabrication tool if necessary. As used herein,the term “fabrication tool” includes any tool that performs a process ona substrate, whether it be deposition, etch, heat treatment, polish,clean, etc.

To further enhance throughput an inventive wafer handling method may beemployed. The inventive wafer handling method increases throughputduring any non-steady-state processing period (startup, tool failure,etc.), by dividing the wafers contained in a wafer carrier among aplurality of fabrication tools that are adapted to perform the sameprocess. In this manner, each fabrication tool can immediately beginprocessing wafers, and throughput is greatly increased as compared toconventional methods which allow the entire wafer carrier full of wafersto remain with a single fabrication tool. Such conventional methodsforce the remaining fabrication tools to idle until a wafer carrier hasarrived for each fabrication tool. Because most conventional fabricationsystems deliver only one wafer carrier per hour, the inventive methodresults in a substantial increase in throughput. Although the inventivewafer handling method is most advantageously employed within a pluralityof connected load buffers, such as those described herein, it may beused within any system containing a plurality of fabrication tools whichperform the same process.

In another aspect of the invention, a method of handling wafers insemiconductor fabrication is provided, including receiving a wafercarrier containing a first plurality of wafers at an incoming wafercarrier location; dividing the first plurality of wafers contained inthe wafer carrier into a plurality of sublot carriers; and deliveringthe sublot carriers each containing an number of wafers, which is lessin amount than the first plurality of wafers.

In a system aspect, a wafer handling system is provided, including anincoming carrier location adapted to receive wafer lot carriercontaining a wafer lot consisting of a first plurality of wafers; adivider mechanism adapted to divide and place the first plurality ofwafers into a plurality of wafer sublots in a plurality of sublotcarriers wherein each sublot carrier includes a fewer number of wafersthan the first plurality of wafers; and a transfer mechanism adapted totransfer the plurality of sublot carriers.

In yet another aspect, a wafer handling apparatus is provided, includinga divider mechanism adapted to divide and place a first plurality ofwafers contained in a wafer carrier into a plurality of wafer sublotscontained in a plurality of sublot carriers, wherein each sublot carrierincludes a fewer number of wafers than the first plurality of wafers;and a transfer mechanism adapted to transfer the plurality of sublotcarriers.

Other objects, features and advantages of the present invention willbecome more fully apparent from the following detailed description ofthe preferred embodiments, the appended claims and the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of shelf-type load buffer of the invention;

FIG. 2 is a front elevational view of the load buffer of FIG. 1 whichshows a preferred arrangement of four storage locations;

FIG. 3 is a top plan view of the load buffer of FIG. 1 which shows apreferred footprint thereof;

FIGS. 4A-4F are side elevational views of the load buffer of FIG. 1,which are useful in explaining a first aspect of wafer carrier transporttherethrough;

FIGS. 5A-5C are side elevational views of the load buffer of FIG. 1,which are useful in explaining a second aspect of wafer carriertransport therethrough;

FIG. 6A is a side elevation view of an aspect of a conveyor-typeinventive load buffer wherein the load ports are contiguous with thevertical transfer mechanisms;

FIG. 6B is a side elevation view of an aspect of a conveyor-type loadbuffer wherein the load ports are adjacent the vertical transfermechanisms;

FIG. 6C is a side elevational view of a local interconnection offabrication tools, which employs the second embodiment of the invention;

FIG. 7A is a side elevational view of a vertically orienteddual-compartment segment of a preferred modular conveyor employed in aconveyor-type load buffer;

FIG. 7B is a side perspective view of a horizontally orienteddual-compartment segment of a preferred modular conveyor employed in aconveyor-type load buffer;

FIG. 8 is a side elevational view of a bi-level conveyor comprised of aplurality of the dual-compartment segments of FIG. 7A;

FIG. 9 is a side elevation view of a preferred embodiment of theinventive load buffer wherein the transfer mechanism comprises thebi-level conveyor of FIG. 8;

FIG. 10 is a top plan view of a conveyor-type load buffer, which employsthe horizontally oriented dual-compartment segment of FIG. 7B;

FIG. 11 is a side elevational view of a horizontally orientedconveyor-type load buffer, taken along line 1-1 of FIG. 10;

FIG. 12 is a top plan view of a fabrication system that is useful indescribing an inventive wafer handling method; and

FIG. 13 is a flow diagram useful in describing the inventive waferhandling method.

DETAILED DESCRIPTION

FIG. 1 is a side view of an inventive load buffer 11. The load buffer 11comprises a first and second vertical transfer mechanism comprised of afirst robot 13 and a second robot 15, respectively. The first robot 13comprises a first y-axis component 17 and a first x-axis component 19movably coupled to the first y-axis component 17 such that the firstx-axis component 19 may travel along the length of the first y-axiscomponent 17. Similarly, the second robot 15 comprises a second y-axiscomponent 21 and a second x-axis component 23 movably coupled to thesecond y-axis component 21 such that the second x-axis component 23 maytravel along the length of the second y-axis component 21. Operativelycoupled between the first robot 13 and the second robot 15 are one ormore storage locations 25 a, 25 b.

The first robot 13 is configured such that when the first x-axiscomponent 19 is at the lower portion of the first y-axis component 17 itmay access a first load port 27 (preferably a SEMI E15 type load port)and such that when the first x-axis component 19 is at the upper portionof the first y-axis component 17 it may access a first overhead loadport (not shown) which provides access to a first overhead wafer carriertransport system such as a monorail, referenced generally by the numeral29 a of FIG. 1.

The second robot 15 is configured such that when the second x-axiscomponent 23 is at the lower portion of the second y-axis component 21it may access a first wafer exchange port 31 and, optionally, such thatwhen the second x-axis component 23 is at the upper portion of thesecond y-axis component 23 it may access an optional second overheadload port which provides access to a second overhead wafer carriertransport system such as a monorail, referenced generally by the numeral29 b in FIG. 1. Both the first x-axis component 19 and the second x-axiscomponent 23 are configured so as to reach any of the storage locations25 a, 25 b. In a preferred embodiment, each load port, each overheadload port and each wafer exchange port may simply comprise apredetermined location.

The first wafer exchange port 31 is preferably located substantially orcompletely above a fabrication tool 33 having at least a transferchamber 32, a process chamber 34 and a first load lock 35. Mostpreferably the first wafer exchange port 31 is located above thetransfer chamber 32 of the fabrication tool 33. Alternatively, however,the wafer exchange port 31 may occupy other locations. The first waferexchange port 31 is operatively coupled to the first load lock 35 via afirst loader mechanism referenced generally by the numeral 37 of FIG. 1.The first loader mechanism 37 comprises a wafer cassette platform suchas that described in co-pending U.S. application Ser. No. 08/763,604 nowU.S. Pat. No. 5,833,426 (AMI Docket No. 1522 the entire disclosure ofwhich is incorporated herein by reference) that extends outside the openload lock 35 to extract wafers from a cassette located on the firstwafer exchange port 31. The first load lock 35 has a first lid 39 and alift-lower mechanism 41.

In the present invention the first loader mechanism 37 is positioned onlift-lower mechanism 41. When the first lid 39 and the lift-lowermechanism 41 are in their elevated positions, as shown in FIG. 1, thefirst loader mechanism 37 extends horizontally, extracts one or morewafers from a first wafer carrier 43 (or, alternatively, can transferthe entire wafer carrier) located on the first wafer exchange port 31and retracts carrying the extracted wafers (or the entire cassette) intoposition on the lift-lower mechanism 41. The lift-lower mechanism 41then lowers the wafers (or the cassette) as the first lid 39 lowers.

Further, in a preferred embodiment the first lid 39 has a wafercarrier-engaging mechanism referenced generally by the numeral 45 ofFIG. 1 which will engage a second lid 47 of a first wafer carrier 43located on the first wafer exchange port 31 causing the second lid 47 toelevate as the first lid 39 elevates. Thus, as shown in FIG. 1, thefirst wafer carrier 43 is open and ready for the first loader mechanism37 to extract wafers for loading to the first load lock 35.

FIG. 2 is a front elevational view of the load buffer 11 of FIG. 1 whichshows a preferred arrangement of four storage locations 25 a, 25 b, 25c, and 25 d, above the first load lock 35 and a second load lock 49. Asshown in FIG. 2, the first load lock 35 is open with the first lid 39elevated and the first wafer carrier 43 loaded on the lift-lowermechanism 41 for subsequent lowering into the first load lock 35. Asecond wafer carrier 51, a third wafer carrier 53, a fourth wafercarrier 55 and a fifth wafer carrier 57 are in storage on the storagelocations 25 a, 25 b, 25 c and 25 d, respectively.

FIG. 3 is a top plan view of the load buffer 11 of FIGS. 1 and 2 whichshows a preferred footprint of the load buffer 11, and which shows inpertinent part, a preferred footprint of the local area semiconductorwafer fabrication system. The four primary horizontal positions of thefirst x-axis component 19 and of the second x-axis component 23 arerepresented as 19 a, 19 b, 19 c, and 19 d, and 23 a, 23 b, 23 c, and 23d respectively. However, it is understood that the first x-axiscomponent 19 and the second x-axis component 23 each occupy only one ofthese positions at a given time. (The primary vertical positions of thefirst x-axis component 19 and of the second x-axis component 23 areshown sequentially in FIGS. 4A-4F and FIGS. 5A-5C.) As shown, the firstload port 27 and a second load port 59 are advantageously positioneddirectly adjacent the first load lock 35 and the second load lock 49 ofthe fabrication tool 33, resulting in the overall footprint of the localarea semiconductor wafer fabrication system being considerably smallerthan that of prior art systems which require sufficient space for afront loader robot. Such advantageous positioning of the first load port27 and the second load port 59 is possible because wafer carriersentering the load buffer 11 via the first load port 27 or the secondload port 59 are extracted from the top of the first load port 27 andthe second load port 59, respectively, rather than from the sidesthereof. A number of other positions can also be employed, particularlyfor side opening load locks. Similarly, in this example, because thefirst load port 27 and the second load port 59 are loaded and unloadedfrom above, they may be positioned in close proximity to each other,unlike side loaded prior art systems whose load ports must be positioneda sufficient distance from each other to accommodate the loader robot'saxis of rotation.

Further, as shown by FIG. 3, storage locations 25 a and 25 c preferablyare positioned above the first load lock 35 and the second load lock 49,respectively, and the first wafer exchange port 31 and a second waferexchange port 61 preferably are positioned above the transfer chamber 32of the fabrication tool 33. The preferred location of the plurality ofstorage locations 25 a-25 d, the first wafer exchange port 31 and thesecond wafer exchange port 61 above the fabrication tool allows thefootprint of the inventive local area semiconductor wafer fabricationsystem to be significantly smaller than that of prior art systems. Thesmaller footprint provided by the present invention reduces the system'scost of ownership which in turn reduces the cost of each unit produced.

FIGS. 4A-4F are side elevational views of the load buffer 11, which areuseful in explaining a first aspect of wafer carrier transport throughthe load buffer 11. The components of the load buffer 11 are describedabove with reference to FIG. 1 and are therefore not repeated here.Further, in the preferred embodiment, the entire load buffer apparatus11 is maintained under a vacuum hood. However, it is understood that ifthe load buffer 11 were not under vacuum, the steps of opening a podtype wafer carrier and loading the wafers to the load lock would beperformed within an enclosed vacuum chamber that would surround eachwafer exchange port and the open load lock associated therewith.

As shown in FIG. 4A the first wafer carrier 43 is in storage at thestorage location 25 a. In operation, a second wafer carrier 51 is placedon the first load port 27 by, for example, an operator, automatic guidedvehicle (AGV) or rail-guided vehicle (RGV), and the first x-axiscomponent 19 of the first robot 13 lowers to pick up the second wafercarrier 51, as shown in FIG. 4A. The second robot 15 operatesindependently of the first robot 13, and may therefore be in anyrequired position at a given time.

Next, as shown in FIG. 4B, the first x-axis component 19 lifts thesecond wafer carrier 51 and pivots to deposit the second wafer carrier51 on the storage location 25 b, as represented by arrow 63.

Thereafter, as shown in the example of FIG. 4C, the first x-axiscomponent 19 may pivot and lower to pick up the third wafer carrier 53from the first load port 27, as the second x-axis component 23 of thesecond robot 15 picks up the first wafer carrier 43 from the storagelocation 25 a, pivots, lowers and deposits the first wafer carrier 43 atthe first wafer exchange port 31, as represented by the arrow 65.

As shown in FIG. 4D the first lid 39 of the first load lock 35 elevates,and the wafer carrier-engaging mechanism 45, which engages the secondlid 47, of the first wafer carrier 43, causes the second lid 47 toelevate. Thus, the first wafer carrier 43 is open and any number ofwafers or the entire cassette 43 a (i.e., the contents of the open podtype first wafer carrier 43) may be transferred from the first waferexchange port 31 to the open first load lock 35. As described withreference to FIG. 1, the first loader mechanism 37 may be a conventionalapparatus, or, preferably, is as described in application Ser. No.08/763,604 now U.S. Pat. No. 5,833,426 (AMI Docket No. 1522). Theapparatus described in Ser. No. 08/763,604 now U.S. Pat. No. 5,833,426(AMI Docket No. 1522) comprises a slotted assembly which extends toposition the slots beneath the wafers to be extracted. The assembly thenelevates, lifting the wafers, and retracts. The assembly can be modifiedsuch that the number of slots correspond to the number of wafers to beextracted, or can be modified to extend to a position beneath the entirecassette, thus transporting the entire cassette when the assemblyretracts.

FIG. 4E shows the wafer cassette 43 a (extracted from the open firstwafer carrier 43) positioned on the lift-lower mechanism 41 forsubsequent lowering into the first load lock 35.

FIG. 4F shows the wafer cassette 43 a positioned within the first loadlock 35, and the first lid 39 of the first load lock 35 in the closedposition. Thereafter wafers may be extracted from the first load lock 35and processed within the fabrication tool 33. The empty first wafercarrier 43 can be closed and moved to one of the storage locations 25a-25 d or can remain positioned on first wafer exchange port 31 untilwafers have been processed and returned to the first wafer carrier 43.

The first robot 13 and the second robot 15 may continue to operateindependently of the loading of the first wafer carrier 43 from thefirst wafer exchange port 31 to the first load lock 35. Although notshown in FIGS. 4E and 4F, the first robot 13 may continue transferringwafer carriers between the first load port 27 and/or the overhead loadport (e.g., a predetermined location along the monorail 29) and theplurality of storage locations 25 a-25 d; and the second robot 15 isable to pick up wafer carriers as required from the plurality of storagelocations 25 a-25 d, and deposit them at either the first wafer exchangeport 31 or the second wafer exchange port 61, provided the particularwafer exchange port is vacant.

The configuration of the load buffer 11 advantageously enablesindependent operation of the first robot 13 and the second robot 15, andenables independent loading and unloading of each pair of load ports(e.g., the first load port and the first wafer exchange port) and theoverhead load ports. Thus, it is understood that the specific operationof the load buffer 11 described with reference to FIGS. 4A-4F is merelyexemplary.

FIGS. 5A-5C are side elevational views of the load buffer of FIG. 2,which are useful in explaining a second aspect of wafer carriertransport therethrough. As shown in FIG. 5A the first x-axis component19 of the first robot 13 pivots to pickup the first wafer carrier 43from the monorail 29. Thereafter as shown in FIG. 5B, the first x-axiscomponent 19 lowers and pivots about the first y-axis component 17 todeposit the first wafer carrier 43 on the storage location 25 b, asrepresented by the arrow 67. Then, as shown in FIG. 5C, the secondx-axis component 23 of the second robot 15 picks up the first wafercarrier 43 from the storage location 25 b and pivots about the secondy-axis component 21 and lowers to deposit the first wafer carrier 43 onthe first wafer exchange port 31, as represented by arrow 69. Thereafterthe first wafer carrier 43 is opened and lowered into the first loadlock 35 as previously described with reference to FIGS. 4D-4F. Whileonly the first wafer carrier 43 is shown traveling through the loadbuffer 11, it is understood that when the first x-axis component 19 andthe second x-axis component 23 are not transporting the first wafercarrier 43, they may be picking up, transporting, or depositing otherwafer carriers at any location within load buffer 11, as previouslydescribed. In sum, the operation of the first robot 13 and the secondrobot 15 may be synchronous at certain times, and also may operateasynchronously at other times. Therefore it is understood that thespecific operation of the load buffer 11 described with reference toFIGS. 5A-5C is merely exemplary.

After processing is complete and the wafers have been returned to theload lock 35, the lid of load lock 35 elevates, the lift/lower mechanism41 lifts the wafers to the elevation of the first wafer exchange port31, and the first loader mechanism 37 returns the wafers to the cassette43 positioned on the wafer exchange port 31. As the first lid 39 of loadlock 35 lowers, lift/lower mechanism 41 lowers, and the second lid 47 ofthe wafer carrier 43 lowers, sealing around the cassette 43 a.Thereafter the second robot 15 transfers the wafer carrier 43 either toa storage shelf 25 or to the second overhead load port. If the secondrobot 15 places the wafer carrier 43 on one of the storage shelves 25,the first robot 13 may then transfer the wafer carrier 43 either to thefirst load port 27 or to the first overhead load port. Thus a wafercarrier full of processed wafers travels backward through the loadbuffer 11 in the same manner as a wafer carrier of unprocessed waferstravels forward through the load buffer 11, only the direction of travelchanges. Each robot elevates a wafer carrier between the respective loadport or wafer exchange port and the overhead load ports or storageshelves. As used herein the term “elevate” refers to any y-axis movementand therefore includes both lifting and lowering.

In operation, at any given time wafer carriers may be traveling bothforward and backward through the load buffer 11. Thus, a robot maytransfer a first wafer carrier to the storage shelves or to the overheadload ports, and then immediately pick up a second wafer carrier fortransfer to one of the load ports or to the wafer exchange ports.

Although with reference to the side elevational views of FIGS. 1, 4A-Fand 5A-C only the first side of the load buffer 11 is shown anddescribed (i.e., the first load port through the first wafer exchangeport) it is understood that the configuration and operation of thesecond side of the load buffer 11 (i.e., the second load port throughthe second wafer exchange port) is identical to that disclosed. Further,although only a single shelf-type load buffer is disclosed, it will beunderstood by those of ordinary skill in the art, that the first robot13 and/or the second robot 15 can be adapted to reach one or moreshelves of an adjacent load buffer, and, central shelves may even bepositioned between two adjacent load buffers so as to provide a positionat which wafer carriers may be passed from one load buffer to the next.

FIG. 6A is a side elevation view of a conveyor-type load buffer 71,wherein the load ports are contiguous with the vertical transfermechanisms. As shown in FIG. 6A, the load buffer 71 comprises a firstload port 73. In the configuration shown, the first load port 73 is aport for loading wafer carriers from the factory. The first load port 73is operatively coupled to a first elevator 75 which receives wafercarriers from the factory through the first load port 73. The upperportion of the first elevator 75 is operatively coupled to one end of ahorizontal transfer mechanism 77, and the other end of the horizontaltransfer mechanism 77 is operatively coupled to the upper portion of asecond elevator 79. A lower portion of the second elevator 79operatively couples a second load port 81. In the configuration shown,the second load port 81 is a port for loading wafer carriers from theload buffer 71 into either a first load lock 83 or a second load lock 85of a fabrication tool 87. In the most preferred embodiment, the firstload port 73 is a predetermined location which the first elevator 75occupies when it is in its lowest position, and the second load port 81is a predetermined location which the second elevator 79 occupies whenit is in its lowest position.

The inventive load buffer 71 shown in FIG. 6B is configured such thatthe first elevator 75 and the second elevator 79 extend to a heightgreater than that of the fabrication tool 87 and such that thehorizontal transfer_ mechanism 77 is located above (i.e., at leastpartially overlapping) the footprint of the fabrication tool 87.Preferably the horizontal transfer mechanism 77 is substantially above,and most preferably completely above the footprint of the fabricationtool 87. It will be apparent to those of ordinary skill in the art thatthe load buffer 71 may be positioned in front of the tool, beside thetool, etc., and that a position above the fabrication tool is merelypreferred. Thus, the load buffer 71 of the present invention provideswafer storage and movement within a minimized footprint. Further, thefirst elevator 75 and/or the second elevator 79 may be operativelycoupled to a wafer carrier transport system. The first elevator 75 andthe second elevator 79 of FIG. 6A are shown operatively coupled to anoverhead wafer carrier transport system 89 via a first overhead loadport 88 and a second overhead load port 90, respectively. In the mostpreferred embodiment, the first overhead load port 88 is a predeterminedlocation which the first elevator 75 occupies when it is in its highestposition, and the second overhead load port 90 is a predeterminedlocation which the second elevator 79 occupies when it is in its highestposition. As shown in FIG. 6B, the horizontal transfer mechanism mayhave an extended portion 77 a, 77 b which respectively extends beyondthe first vertical transfer mechanism 75 and/or the second verticaltransfer mechanism 81. The extended portions 77 a, 77 b provideadditional storage locations, and can be coupled to the horizontaltransfer mechanism 77 (or to the extended portions 77 a, 77 b) ofanother fabrication tool to provide a local interconnection offabrication tools (see FIG. 6C).

In operation an automated local area fabrication system; comprising theload buffer 71, at least the first load lock 83, and at least oneprocessing chamber; receives a wafer carrier in the first load port 73.Typically the wafer carrier will be traveling from a previous processinglocation (e.g., an additional automated local area fabrication system)and may be transported to and loaded into the first load port 73 via afactory automation system, an automatic guided vehicle, or an operator,etc. The wafer carrier is loaded via the first load port 73 into thefirst elevator 75. The first elevator 75 elevates the wafer carrier tothe upper portion of the first elevator 75 which is connected to thehorizontal transfer mechanism 77. Thereafter the wafer carrier istransferred to the horizontal transfer mechanism 77 via conventionalmethods, for example, the first elevator 75 may comprise an x-y robotthat delivers a wafer carrier to the horizontal transfer mechanism 77and then returns to the first load port 73, or, the first elevator 75may comprise a surface of rolling elements which are actuated when thesurface is aligned with the horizontal transfer mechanism 77, causingthe wafer carrier to be transferred across the rolling elements to thehorizontal transfer mechanism 77.

After traveling though the horizontal transfer mechanism 77 the wafercarrier is transferred from the horizontal transfer mechanism 77 to theupper portion of the second elevator 79 via conventional methods. Thesecond elevator 79 then lowers the wafer carrier to the second load port81 where a conventional loader mechanism 91 (e.g., a robot) transfersone or more wafers, or the entire wafer carrier from the second loadport 81 to either the first load lock 83 or the second load lock 85 ofthe fabrication tool 87. Within the fabrication tool 87 wafers aretransferred from the first load lock 83 or the second load lock 85 toone or more process chambers 86 (see FIG. 10) for processing.Alternatively, the first elevator 75 and/or the second elevator 79 maytransfer a wafer carrier to the overhead factory transfer system 89 viathe first overhead load port 88 or the second overhead load port 90.

FIG. 6B is a side elevation view of a preferred embodiment of aninventive load buffer wherein the first load port 73 is adjacent thefirst vertical transfer mechanism 75, and the second load port 81 isadjacent the second vertical transfer mechanism 79. Each load port iscoupled to the respective vertical transfer mechanism via conventionalmethods (e.g., a pick and place robot, a plurality of rolling elements,etc.) which transfer a wafer carrier between the respective load portand the vertical transfer mechanism. This type of adjacent configurationcould be used to retrofit existing fabrication tools with the loadbuffer of the present invention. Except for the positioning of the loadports and the vertical transfer mechanisms, the load buffer of FIG. 6Bis configured and operates the same as that of FIG. 6A.

FIG. 6C is a side elevational view of a local interconnection offabrication tools. As shown in FIG. 6C, a plurality of fabrication tools87 a, 87 b, 87 c are interconnected via the extended horizontal transfermechanisms 77 a, 77 b, of load buffers 71 a, 71 b and 71 c.Specifically, the extended portion 77 a of the load buffer 71 a iscoupled to the extended portion 77 b of the load buffer 71 b, and theextended portion 77 a of the load buffer 71 b is coupled to the extendedportion 77 b of the load buffer 71 c. In this configuration, a wafercarrier may advantageously travel directly between the interconnectedload buffers, without the aid of the overhead wafer carrier transportsystem, an AGV or operator. Such local interconnection of fabricationtools increases the flexibility and the transaction capability of thefactory material handling system.

FIGS. 7A and 7B depict individual segments of a preferred horizontaltransfer mechanism. FIG. 7A is a side view of a dual-compartment segment93 of a preferred modular conveyor employed in a first aspect of theconveyor-type inventive load buffer. The conveyor segment 93 comprises afirst compartment 95 and a second compartment 97, respectively having afirst surface 99 comprised of a plurality of rolling elements 99 a-e anda second surface 101 comprised of a plurality of rolling elements 101a-e. In a preferred embodiment a plurality of the conveyor segments 93of FIG. 7A are operatively coupled to form a modular bi-level conveyor103 (see FIGS. 8 and 9). Any number of dual-compartment segments 93 maybe coupled together so as to form a bi-level conveyor 103 of a desiredlength. The bi-level structure guarantees an open movement channel, andcan be constructed by joining levels of conventional rolling elementtype conveyors such as those manufactured by Middlesex GeneralIndustries, Inc. of Woburn, Mass. and described in U.S. Pat. No.4,793,262, entitled “Transport System For Computer IntegratedManufacturing/Storage And Drive Component Therefore,” the entirety ofwhich is incorporated herein by this reference.

FIG. 7B is a side perspective view of an alternative horizontallyoriented dual-compartment segment 93 of a preferred modular conveyoremployed in a second aspect of the inventive conveyor-type load buffer.Like the conveyor segment 93 of FIG. 7A, the conveyor segment 93 of FIG.7B comprises the first compartment 95 and the second compartment 97respectively having the first surface 99 comprised of the plurality ofrolling elements 99 a-e and the second surface 101 comprised of theplurality of rolling elements 101 a-e. In a preferred embodiment aplurality of the conveyor segments 93 of FIG. 7B are operatively coupledto form a modular conveyor 103 (see FIGS. 8 and 10). Any number ofdual-compartment segments 93 may be coupled together so as to form aconveyor 103 of a desired length.

FIG. 8 is a side elevational view of a bi-level conveyor 103 comprisedof a plurality of the dual-compartment segments 93 of FIG. 7A, whereinthe dual-compartment segments 93 a-d are vertically oriented and coupledtogether to provide a storage and movement channel. FIG. 8 is useful fordescribing two positions (a neutral position and a positive position)each dual-compartment segment 93 may assume. In FIG. 8, dual-compartmentsegment 93 a and dual-compartment segment 93 c are shown in the neutralposition, and dual-compartment segment 93 b and dual-compartment segment93 d are shown in the positive position. Three channels are defined bythe two possible positions of the dual-compartment segments 93 a-d; amove channel 105, a shuttle channel 107 and a storage channel 109. Inthe neutral position the first compartment 95 of the dual-compartmentsegment 93 occupies the move channel 105, and the second compartment 97of the dual-compartment segment 93 occupies the shuttle channel 107.

In the positive position the first compartment 95 of thedual-compartment segment 93 occupies the storage channel 109 and thesecond compartment 97 of the dual-compartment segment 93 occupies themove channel 105. Thus, although a given dual-compartment segment 93 maybe positioned such that a compartment occupies either the shuttlechannel 107 or the storage channel 109, each dual-compartment segment 93has a compartment which occupies the move channel 105. Therefore themove channel 105 is a continuous channel, formed of the firstcompartment 95 and/or the second compartment 97 of a plurality of thedual-compartment segments 93, through which wafer carriers may travel;and the shuttle channel 107 and the storage channel 109 areintermittently occupied by the second compartment 97 or the firstcompartment 95, respectively, of one or more dual-compartment segments93. Thus, the shuttle channel 107 and/or the storage channel 109 maystore wafer carriers without blocking the passage of wafer carriersthrough the move channel 105.

In the preferred operation, initially each dual-compartment segment 93a-d is neutrally positioned. A first wafer carrier (not shown) is thenloaded into the first compartment 95 of dual-compartment segment 93 aand can: 1) travel immediately along the move channel 105 to the end ofthe bi-level conveyor 103 where the first wafer carrier will be unloadedfrom the bi-level conveyor 103; 2) travel a distance along the bi-levelconveyor 103 (e.g., to dual-compartment segment 93 b, 93 c or 93 d) andthen be placed in storage (e.g., placed in the storage channel 109 byshifting the respective dual-compartment segment 93 to a positiveposition); or 3) immediately be placed in storage (e.g., by shiftingdual-compartment segment 93 a to a positive position).

To remove a wafer carrier from storage and return the wafer carrier tothe move channel 105, the dual-compartment segment 93 containing thewafer carrier is shifted from the positive position to the neutralposition. Thereafter, the wafer carrier may continue traveling along themove channel 105. Thus, by employing a bi-level conveyor 103 and bydesignating one channel for storage and one channel for movement, afirst wafer carrier may be placed in storage at any point along thebi-level conveyor 103 (i.e., within any of the plurality ofdual-compartment segments 93 a-d) without obstructing the passage of asecond wafer carrier through the move channel 105. Although the movechannel 105 is preferably used only for moving wafer carriers, and thestorage channel 109 is preferably used only for storing wafer carriers,the storage channel 109 and/or the move channel 105 may perform acombination of storage and movement functions.

FIG. 9 is a side elevation view of a preferred embodiment of aninventive load buffer 71 wherein the horizontal transfer mechanism 77comprises the bi-level conveyor 103 of FIG. 8. The overall configurationof the load buffer 71 and the bi-level conveyor 103 are described withreference to FIGS. 6 and 8, respectively, and are therefore not repeatedhere. The operation of the load buffer of FIG. 8 is described below.

In operation an automated local area fabrication system; comprising theload buffer 71, at least the first load lock 83, and at least oneprocessing chamber; receives a wafer carrier in the first load port 73.Typically the wafer carrier will be traveling from a previous processlocation (e.g., an additional automated local area fabrication system)and may be transported to and loaded into the first load port 73 via,for example, a factory automation system, an automatic guided vehicle,or an operator. The wafer carrier is loaded via the first load port 73into the first elevator 75. The first elevator 75 elevates the wafercarrier to the upper portion of the first elevator 75 which is connectedto the bi-level conveyor 103. Thereafter the wafer carrier istransferred to the bi-level conveyor 103 via conventional methods. Anactuator (not shown) controls the bi-level conveyor 103 causing a givendual-compartment segment 93 to shift from the neutral position to thepositive position and vice versa. The actuator also controls theoperation of the first plurality of rolling elements 99 a-e, and thesecond plurality of rolling elements 101 a-e, selectively causing themto rotate and thus to transfer a wafer carrier from one universe ofrolling elements to the next. By selectively shifting thedual-compartment segments 93 a-d and rotating the plurality of rollingelements 99 a-e and 101 a-e, wafer carriers are stored in the storagechannel 109 and transferred through the move channel 105, as describedpreviously in conjunction with FIG. 8.

After traveling though the bi-level conveyor 103 the wafer carrier istransferred from the bi-level conveyor 103 to the upper portion of thesecond elevator 79 via conventional methods. The second elevator 79 thenlowers the wafer carrier to the second load port 81 where a conventionalloader mechanism 91 (e.g., a robot) transfers one or more wafers at atime, or transfers the entire wafer carrier, from the second load port81 to either the first load lock 83 or the second load lock 85 of thefabrication tool 87. Within the fabrication tool 87 wafers aretransferred from the first load lock 83 or the second load lock 85 toone or more process chambers 86 (see FIG. 10) for processing.Alternatively, the first elevator 75 and/or the second elevator 79 maytransfer a wafer carrier to the overhead factory transfer system 89,and/or the bi-level conveyor 103 may transfer a wafer carrier directlyto the load buffer of a locally connected fabrication tool.

FIG. 10 is a top plan view of a conveyor-type load buffer 71, whichemploys the horizontally oriented dual-compartment segment 93 of FIG.7B. As shown in FIG. 10 the dual-compartment segment 93 c is neutrallypositioned (i.e., the first compartment 95 occupies the move channel 105and the second compartment 97 occupies the shuttle channel 107) and thedual-compartment segments 93 a, 93 b and 93 d are positively positioned(i.e., with the first compartment 95 occupying the storage channel 109and the second compartment 97 occupying the shuttle channel 107).

In the example of FIG. 10 a first wafer carrier 111 is stored bydual-compartment segment 93 d, a second wafer carrier 113 is stored bydual-compartment segment 93 b, and a third wafer carrier 115 is storedby dual-compartment segment 93 a. A fourth wafer carrier 117 and a fifthwafer carrier 119 are moving through the move channel 105. The fourthwafer carrier 117 is moving from the first compartment 95 of thedual-compartment segment 93 c to the first compartment 95 of thedual-compartment segment 93 d, and the fifth wafer carrier 119 is movingthrough the first compartment 95 of the dual-compartment segment 93 b.As this example shows, a single dual-compartment segment 93 may containwafer carriers in both the first compartment 95 and in the secondcompartment 97 at any given time, as does dual-compartment segment 93 b.Also as this example shows, at any given time the move channel 105 maycomprise either the first compartment 95 or the second compartment 97 ofa given dual-compartment segment 93.

As with the vertically oriented bi-level conveyor 103 of FIG. 8, in thepreferred operation of FIG. 10, each dual-compartment segment 93 isinitially neutrally positioned, a first wafer carrier is then loadedinto the first compartment 95 of the dual-compartment segment 93 a andcan: 1) travel immediately along the move channel 105 to the end of thebi-level conveyor 103 where the first wafer carrier will be unloadedfrom the bi-level conveyor 103 and placed within the second elevator 79(see FIG. 11); 2) travel a distance along the bi-level conveyor 103(e.g., to dual-compartment segment 93 b, 93 c or 93 d) and then beplaced in storage (e.g., placed in the storage channel 109 by shiftingthe respective dual-compartment segment 93 to a positive position); or3) immediately be placed in storage (e.g., by shifting dual-compartmentsegment 93 a to a positive position).

To remove a wafer carrier from storage and return it to the move channel105, the dual-compartment segment 93 containing the wafer carrier isshifted from the positive position to the neutral position. Thereafter,the wafer carrier may continue traveling along the move channel 105.Thus, by employing a dual-compartment conveyor 103 and by designatingone channel for storage and one channel for movement, a first wafercarrier may be placed in storage at any point along the bi-levelconveyor 103 (i.e., within any of the plurality of dual-compartmentsegments 93 a-d) without obstructing the passage of a second wafercarrier through the move channel 105. Although the move channel 105 ispreferably used only for moving wafer carriers, and the storage channel109 is preferably used only for storing wafer carriers, the storagechannel 109 and/or the move channel 105 may perform a combination ofstorage and movement functions. Although the load buffer 71 of FIG. 10is positioned above a fabrication tool, a person of ordinary skill inthe art will recognize that it may be positioned for example, in frontof, or beside, a fabrication tool.

FIG. 11 is a side elevational view of the conveyor-type load buffer 71,taken along line 1-1 of FIG. 10. Thus, while FIG. 11 shows only the movechannel 105—the shuttle channel 107 and the storage channel 109 are inthe plane perpendicular to the page. Except for the horizontalorientation of the bi-level conveyor 103 (described with reference toFIG. 10), the configuration and operation of the load buffer 71 shown inFIG. 11 is the same as that described with reference to FIG. 9, furtherdescription is therefore omitted.

As previously stated, the load buffer embodiments described above aremerely the currently preferred embodiments. Other embodiments willlikewise benefit from the inventive features taught herein, such as thelocal interconnection of fabrication tools, the ability to receive wafercarriers from overhead factory transport mechanisms, the ability for thefactory load port and the tool load port to operate independently, etc.

Similarly, an inventive method of wafer handling is now provided whichis particularly advantageous when employed with the interconnectedconveyor-type load buffers shown in FIG. 6C. However, it should be notedthat the inventive method can be advantageously employed within anyfabrication system that employs a plurality of tools for simultaneouslyperforming a process (preferably the same process), as better understoodwith reference to FIG. 12.

FIG. 12 is a top plan view of a tool set 111 that is useful indescribing an inventive wafer handling method. The tool set 111, as anexample, comprises three fabrication tools 113 a-c each of whichperforms the same process. Although the inventive method is mostadvantageously employed with a set of tools that perform the sameprocess, it may also be employed with a set of tools that performvarious different processes.

In its broadest sense, the inventive method comprises receiving a wafercarrier containing a plurality of wafers (i.e., a wafer lot), at afabrication tool, or at an incoming wafer carrier location 115 of thetool set 111, dividing the wafer lot into a plurality of sublots anddelivering these sublots to a plurality of the tools within the tool set111. In this manner, the plurality of tools may begin processing shortlyafter receipt of the first wafer lot. The sublots may be delivered tothe tools 113 a-c via the same mechanism (e.g., factory transport) whichdelivered the lot, or may be delivered via a local transfer mechanism(represented generally by the number 117) such as a local connection ofload buffers (e.g., those pictured in FIG. 6C). The wafer lot ispreferably divided equally between the number of tools in the set. Thus,as shown in FIG. 12 a 25 wafer lot is received at incoming wafer carrierlocation 115, and is divided into a 9 wafer sublet and two 8 wafersublots, and placed in three previously empty carriers 119 a-c, whichare delivered via local transfer mechanism 117 to the fabrication tools113 a-c.

The present invention preferably provides a control program generallyrepresented by the number 119 which may be stored in any computerreadable medium (e.g., a hard disc, floppy disc, carrier wave signal,etc.). The control program may be part of the overall program thatcontrols manufacturing execution and material control, or may be aseparate program. When a separate program and an incoming wafer carrierlocation 115 are employed, both the manufacturing execution/materialcontrol program and the wafer handling equipment can be significantlysimplified, as fewer locations (in this example a third of thelocations) will need to be accessed thereby.

A control program for carrying out the inventive method is set forth inFIG. 13. As described by FIG. 13, a controller checks to see if any ofthe fabrication tools in the set are operational (e.g., not broken,etc.) and are in need of wafers (block 1). If an operational tool ortools exist and are in need of wafers, wafers waiting to be loaded intoother tools are distributed in sublots to one or more of the tools whichneed wafers (block 2). Preferably the wafers are redistributedoptimally, according to an algorithm, (e.g., as close to equally aspossible) among the tools in the set. Any mechanism may be used todivide the wafers into sublots and redistribute the wafers, such as thefabrication tool's front end loader robot, etc. Empty wafer carriers maybe in storage waiting for sublet formation. After processing iscomplete, the sublots may be recombined (e.g., by the loader robot) ormay proceed to the next equipment set in sublots.

The inventive method allows a tool set to assume steady state processingin a fraction (in this example approximately one third) the time that isrequired by conventional methods, and is therefore advantageous duringany transient processing condition (startup, tool failure, etc.)

The foregoing description discloses only the preferred embodiment of theinvention, modification of the above disclosed apparatus and methodwhich fall within the scope of the invention will be readily apparent tothose of ordinary skill in the art. For instance, although only fourstorage locations 25 a, 25 b, 25 c and 25 d are shown, additionalstorage locations could be provided. Although each of the storagelocations 25 a, 25 b, 25 c and 25 d is shown as being wide enough tohold only a single wafer carrier, the size of the storage locations mayvary so as to hold a plurality of wafer carriers. As well, the specificapparatus employed as the first and second vertical transfer mechanismmay vary, as may the specific location and coupling of components.

Although the dual-compartment segment 93 is shown as having only a firstcompartment 95 and a second compartment 97, the dual-compartment segment93 may have additional compartments which could provide additionalstorage locations or additional movement channels. Although eachdual-compartment segment 93 is shown as being wide enough to hold only asingle wafer carrier, the size of dual-compartment segment 93 may vary.

In operation, any channel may perform both storage and movement at agiven time, and the first and second load ports may each function asboth a factory load port and a tool load port. The horizontal transfermechanism is not limited to the conveyor system disclosed. Otherequivalent transfer mechanisms will be apparent to those of ordinaryskill in the art. Although a horizontal transfer mechanism thatcomprises both a storage and a move channel is preferred, the horizontaltransfer mechanism may comprise a single channel. Preferably the firstand second load ports will conform to the specifications set forth inSEMI-E15, however, other load ports could be used.

The load buffer apparatus is described as transferring wafer carriers,however, it should be understood that the invention is not limitedthereto, and wafers may be transferred individually, and/or in SMIF orother type pods, etc. The pods need not be of the bottom opening type,for instance, side or top opening pods may be employed within theinventive system. If used for transferring SMIF or other type pods theload buffer of the present invention preferably would include amechanism for opening and closing the pod at the tool load port, such asthose conventionally known in the art.

Finally, although FIG. 12 shows the equipment set as comprising aplurality of adjacent tools, the inventive method can be used withequipment sets that are not adjacent, and are not locally connected. Thetool sets may comprise any number of tools; the three tools of FIG. 12are merely exemplary.

Accordingly, while the present invention has been disclosed inconnection with the preferred embodiments thereof, it should beunderstood that other embodiments may fall within the spirit and scopeof the invention, as defined by the following claims.

1. A method of handling wafers in semiconductor fabrication, comprising:receiving a wafer carrier containing a first plurality of wafers at anincoming wafer carrier location; dividing the first plurality of waferscontained in the wafer carrier into a plurality of sublot carriers; anddelivering the sublot carriers each containing an number of wafers,which is less in amount than the first plurality of wafers.
 2. Themethod of claim 1, further comprising delivering the plurality of sublotcarriers to a plurality of tools.
 3. The method of claim 2, wherein theplurality of tools are included in a tool set wherein each tool isadapted to perform a same process.
 4. The method of claim 2, wherein theplurality of tools are included in a tool set wherein each tool isadapted to perform a different process.
 5. The method of claim 1,wherein the first plurality of wafers consists of a wafer lot.
 6. Themethod of claim 5, wherein the wafer lot is divided equally between anumber of tools in a tool set to which the wafer lot is destined.
 7. Themethod of claim 1, further comprising delivering the plurality of sublotcarriers to a plurality of tools with a local transfer mechanism.
 8. Themethod of claim 1, further comprising delivering the wafer carriercontaining a first plurality of wafers to the plurality of tools via afactory transport.
 9. The method of claim 1, wherein the sublot carrierscomprise empty carriers prior to dividing the wafer lot into the sublotcarriers.
 10. The method of claim 1, further comprising: determiningwith a control program if any tools in a tool set are operational and inneed of wafers; and delivering the sublot carriers to the tools whichare operational and in need of wafers.
 11. The method of claim 1,further comprising: processing the plurality of sublots; and recombiningthe sublots into a wafer carrier.
 12. The method of claim 1, furthercomprising: processing the sublots; and transporting the sublots to anext tool in sublot carriers.
 13. A wafer handling system, comprising:an incoming carrier location adapted to receive wafer lot carriercontaining a wafer lot consisting of a first plurality of wafers; adivider mechanism adapted to divide and place the first plurality ofwafers into a plurality of wafer sublots in a plurality of sublotcarriers wherein each sublot carrier includes a fewer number of wafersthan the first plurality of wafers; and a transfer mechanism adapted totransfer the plurality of sublot carriers.
 14. The system of claim 13,wherein the incoming carrier location interfaces with the factorytransport.
 15. The system of claim 13, wherein the transfer mechanism isa local transfer mechanism adapted to deliver the sublot carriers to atool set.
 16. The system of claim 13, wherein the divider mechanismcomprises a front end loader robot.
 17. The system of claim 13, furthercomprising a controller adapted to execute a control program todetermine if any tools in a tool set are operational and in need ofwafers, and prompting delivery of the sublot carriers to the tools whichare operational and in need of wafers.
 18. The system of claim 13,wherein the transfer mechanism transfers the plurality of subletcarriers to a plurality of tools included in a tool set.
 19. A waferhandling apparatus, comprising: a divider mechanism adapted to divideand place a first plurality of wafers contained in a wafer carrier intoa plurality of wafer sublots contained in a plurality of subletcarriers, wherein each sublet carrier includes a fewer number of wafersthan the first plurality of wafers; and a transfer mechanism adapted totransfer the plurality of sublet carriers.
 20. The wafer handlingapparatus of claim 19 further comprising a local transfer mechanismadapted to deliver the plurality of sublet carriers to a plurality oftools.